Company Filing History:
Years Active: 2021
Title: Di Zhan - Innovator in Semiconductor Technology
Introduction
Di Zhan is a prominent inventor based in Hubei, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique wafer structure and manufacturing method.
Latest Patents
Di Zhan holds 1 patent for his invention titled "Wafer structure and method for manufacturing the same, and chip structure." This patent describes a wafer structure that includes a method for its manufacturing. The invention features a design where two wafers are bonded together, incorporating an opening that extends through the substrate of one of the wafers. A concave-convex structure is formed in the dielectric layer beneath the opening. This design allows for at least one concave portion of the structure to expose the interconnection layer of the wafer. A pad is created on the concave-convex structure, which mirrors the arrangement of the underlying structure. This innovative approach effectively increases the contact surface area of the pad without expanding its floor space.
Career Highlights
Di Zhan is currently employed at Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. His work at this company has been instrumental in advancing semiconductor manufacturing processes. His expertise in wafer technology has positioned him as a key player in the industry.
Collaborations
Di Zhan collaborates with notable colleagues, including Tianjian Liu and Guoliang Ye. Their combined efforts contribute to the ongoing innovation in semiconductor technology.
Conclusion
Di Zhan's contributions to the semiconductor field through his innovative patent and collaborative efforts highlight his importance as an inventor. His work continues to influence advancements in technology and manufacturing processes.