Harbin, China

Di Yuan

This inventor holds 1 USPTO granted patent. Top assignee: Institute of Food Processing, Haas. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Di Yuan. Retrieved from https://idiyas.com/inventor/di-yuan-8wsz2bhd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Di Yuan and Microwave-Induced Cracking for Easy-to-Cook Whole Grains.

Introduction

Di Yuan is an inventor associated with Harbin, China, and the Institute of Food Processing, Haas. His work includes a food-processing invention designed to make whole grains easier to cook while retaining their complete-grain form.

Latest Patents

Yuan is credited with 1 patent: “Preparation Method of Easy-to-Cook Whole Grain Based on Microwave-Induced Cracking.” The method applies heat-moisture treatment, followed by short-time microwave-induced cracking, tempering, and cooling. The resulting grains remain intact, have slightly expanded in volume, and develop fine surface cracks. During rice steaming, their water absorption increases from 1.35 times to 1.9 times the original weight of unprocessed whole grains.

Career Highlights

Yuan’s patent focuses on improving whole-grain preparation through a sequence of processing steps. The disclosed approach aims to increase water absorption during cooking while preserving the grains’ overall structure.

Collaborations

Yuan’s listed coworkers include Shuwen Lu and Chuanying Ren. The patent is associated with the Institute of Food Processing, Haas.

Conclusion

Di Yuan’s patented method applies microwave-induced cracking to produce whole grains that absorb more water during steaming while retaining their complete-grain form.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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