This inventor holds 1 USPTO granted patent. Top assignee: Tianjin Sanan Optoelectronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Di Song and Wafer Singulation Innovation
Introduction
Di Song is an inventor based in Tianjin, China, and is associated with Tianjin Sanan Optoelectronics Co., Ltd. His patent work addresses wafer processing for LED chips and light-emitting modules.
Latest Patents
The provided information lists 1 patent for Di Song: “Wafer Singulating Method and LED Chip and Light Emitting Module.” The invention describes laser deep-scribing along front-side wafer scribe lines to create intersecting trenches, followed by cleaving the wafer’s back side along those trenches. Cleaving proceeds from the wafer’s periphery toward its center in different directions, following the trenches sequentially and stopping near or at the center.
Career Highlights
Song’s listed patent focuses on a wafer-singulation process intended for LED chip and light-emitting module production. The supplied information identifies Tianjin Sanan Optoelectronics Co., Ltd. as his company.
Collaborations
The listed coworkers are Yuxian Tian and Xinjie Ding. The provided information does not specify their roles in the patent or their particular contributions.
Conclusion
Di Song’s listed invention applies laser scribing and controlled back-side cleaving to wafer singulation, connecting his patent work with LED chip and light-emitting module manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile