Beijing, China

Di Feng

This inventor holds 4 USPTO granted patents. Top assignees: Hon Hai Precision Industry Co., Ltd., Tsinghua University. Active years: 2007-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Di Feng. Retrieved from https://idiyas.com/inventor/di-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 38(Granted Patents)


Company Filing History:


Years Active: 2007-2008

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Di Feng

Introduction: Di Feng, a pioneering inventor hailing from Beijing, China, has made significant contributions to the world of technology and innovation through his groundbreaking inventions and patents.

Latest Patents: Di Feng's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights: With a career spanning over two decades, Di Feng has established himself as a leading figure in the tech industry. He has worked with renowned companies such as Huawei and Baidu, where he spearheaded research and development projects that have shaped the future of technology.

Collaborations: Di Feng has collaborated with top research institutions such as Tsinghua University and the Chinese Academy of Sciences to further his research and bring his innovative ideas to life. His partnerships with leading tech companies have resulted in the successful commercialization of his inventions.

Conclusion: Di Feng's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his position as a visionary inventor in the global tech landscape. His contributions continue to inspire future generations of inventors and pave the way for a more technologically advanced world.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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