Shenzhen, China

Deyan Li


Average Co-Inventor Count = 3.4

ph-index = 1


Company Filing History:


Years Active: 2024-2025

where 'Filed Patents' based on already Granted Patents

2 patents (USPTO):

Title: Innovations of Deyan Li in Display Technology

Introduction

Deyan Li is a prominent inventor based in Shenzhen, China, known for his contributions to display technology. With a focus on enhancing the functionality and performance of display panels, he has secured two patents that showcase his innovative approach to solving common issues in the field.

Latest Patents

Deyan Li's latest patents include an array substrate, a display panel, and a manufacturing method of the array substrate. The array substrate features a thin film transistor layer, a passivation layer, and a pixel electrode layer arranged sequentially. The passivation layer is designed with a first via hole and a second via hole that are staggered from each other. This configuration allows the pixel electrode layer to connect to a first conductive layer through the via holes, effectively preventing grayscale dark spots that can occur when the pixel electrode is compromised at the connection point. Additionally, his display panel patent addresses the deformation of fonts during display by strategically positioning the drive circuit board and scan driving circuit on the respective sides of the panel.

Career Highlights

Deyan Li is currently employed at Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., where he continues to push the boundaries of display technology. His work has significantly contributed to advancements in the industry, particularly in improving the reliability and quality of display panels.

Collaborations

Deyan collaborates with talented coworkers such as Yang Liu and Jun Yi, who share his passion for innovation in display technology.

Conclusion

Deyan Li's innovative patents and career achievements highlight his significant role in advancing display technology. His work not only addresses existing challenges but also paves the way for future developments in the field.

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