Xi'an, China

Dexiao Xia

This inventor holds 1 USPTO granted patent. Top assignee: Xidian University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dexiao Xia. Retrieved from https://idiyas.com/inventor/dexiao-xia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Dexiao Xia and High-Power Metasurface Innovation.

Introduction

Dexiao Xia is an inventor based in Xi’an, China, and is associated with Xidian University. His listed patent concerns a reconfigurable metasurface designed for high-power amplification and non-reciprocal reflection.

Latest Patents

Xia is credited with 1 patent: “2-bit high-power amplifying non-reciprocal reflective metasurface.” The invention uses an array of metasurface units, each built from stacked metal layers and an intermediate layer. Its second metal layer includes receiving and transmitting patches, with diodes and orthogonally oriented slots arranged to support the design. A phase shifter in the first metal layer uses two series-diode groups to form a reconfigurable 90-degree phase-shift circuit.

Career Highlights

The available information identifies Xia’s work through this patent and his association with Xidian University. The invention combines configurable phase shifting with a metasurface architecture intended for high-power, non-reciprocal reflective operation.

Collaborations

Long Li and Ruijie Li are listed as Xia’s coworkers. The provided information does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Dexiao Xia’s listed patent presents a reconfigurable metasurface approach that brings together high-power amplification, non-reciprocal reflection, and phase control.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…