Dewen Tian

Title: **Dewen Tian: Innovator in SIP Packaging Technologies**

Introduction

Dewen Tian is a prominent inventor based in Shandong, China, recognized for his contributions to the field of microelectronics through his innovative patents. With a total of five patents to his name, his work primarily focuses on advanced packaging technologies that enhance circuit functionality and efficiency.

Latest Patents

Dewen Tian's most recent patents reveal significant advancements in the packaging processes for System in Package (SIP) technology. One of his notable inventions is a "Shielding process for SIP packaging." This patent discloses a method that includes providing a circuit board, cutting a covering layer to create half-cut trenches that separate various SIP modules, and forming grooves in each module for effective shielding. The process culminates in producing separate SIP modules while maintaining the integrity of the design.

Another critical patent is the "Packaging method for circuit units comprising circuit baseplate." This innovation outlines a comprehensive packaging method where circuit units made of silicon substrates are inverted and attached to a baseplate. The method involves creating an insulator between units, removing the silicon substrate, and forming an electromagnetic shielding layer, which ensures enhanced performance and protection for the circuit units.

Career Highlights

Dewen Tian is currently employed at Weifang Goertek Microelectronics Co., Ltd., where he applies his expertise in the microelectronics sector. His innovative approaches have not only contributed to the company's growth but have also positioned him as a key player in the industry, further pushing the boundaries of SIP technologies.

Collaborations

Throughout his career, Dewen Tian has collaborated with esteemed professionals, including Qinglin Song and Kaiwei Wang. These collaborations have fostered an environment of innovation, allowing them to tackle complex challenges in microelectronics and develop pioneering solutions that advance the field.

Conclusion

Dewen Tian exemplifies the spirit of innovation in the fast-evolving landscape of microelectronics. His patents not only illustrate his technical prowess but also provide valuable contributions to future technologies in SIP packaging. As he continues to work at Weifang Goertek Microelectronics Co., Ltd., his ongoing efforts are sure to inspire further advancements in this vital area of research and development.