Company Filing History:
Years Active: 2014-2018
Title: Dewen Tian: Innovator in Die Bonding Technology
Introduction
Dewen Tian is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, holding a total of 2 patents. His innovative approaches have advanced the methods used in semiconductor manufacturing.
Latest Patents
Dewen Tian's latest patents include a method for die bonding with liquid phase solder. This method involves heating a die with solder bumps to a temperature above the melting point of the solder, allowing for effective bonding to a substrate. The process includes moving the die to a specific height for contact with bond pads and subsequently cooling the die to solidify the solder. Another notable patent is focused on bond pad assessment for wire bonding. This patent outlines a technique for selecting suitable bonding parameters by creating indentations on bond pads and measuring the depth-force profile to determine optimal bonding conditions.
Career Highlights
Dewen Tian is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop and refine innovative technologies in the semiconductor industry. His work has been instrumental in enhancing the efficiency and reliability of die bonding processes.
Collaborations
Dewen collaborates with talented colleagues, including Ming Li and Yiu Ming Cheung, who contribute to the innovative environment at Asm Technology Singapore Pte Ltd.
Conclusion
Dewen Tian's contributions to die bonding technology exemplify his commitment to innovation in the semiconductor field. His patents reflect a deep understanding of the complexities involved in bonding processes, making him a valuable asset to his company and the industry as a whole.