Company Filing History:
Years Active: 1998
Title: **Dev-Yuan Wu: Innovator in Bonding Pad Technology**
Introduction
Dev-Yuan Wu, an accomplished inventor based in Hsin-Chu, Taiwan, is known for his significant contributions to the field of semiconductor technology. His insightful innovations aim to enhance the reliability and efficiency of electronic devices through improved bonding techniques.
Latest Patents
Dev-Yuan Wu holds a noteworthy patent titled "Method of forming a bonding pad." This patent revolutionizes the process of forming bonding pads that facilitate better bonding between bond wires and metal bonding pads. The invention details a unique structure where stripes are formed on a substrate, followed by the formation of a conformal dielectric layer, a conformal barrier layer, and a metal layer over these stripes. The process also includes creating a passivation layer that defines the bonding pad area. The irregular surface generated by the stripes in the barrier and metal layers plays a crucial role in reducing stress across the differing layers, ultimately enhancing the adhesion of barrier metals to the dielectric layer, minimizing bond pad peel-off, and increasing bonding yields.
Career Highlights
Dev-Yuan Wu's career is marked by his tenure at United Microelectronics Corp., where he has made significant impacts in semiconductor bonding technologies. His innovative approach and persistence in research have led to advancements that continue to benefit the industry.
Collaborations
Throughout his career, Dev-Yuan Wu has collaborated with notable colleagues including Liu Ming-Tsung and Bill Y Hsu. These partnerships have fostered an environment of creativity and shared expertise, driving forward their joint endeavors in semiconductor research and development.
Conclusion
Dev-Yuan Wu exemplifies the spirit of innovation in the semiconductor industry through his inventive methods for improving bonding pad technologies. His contributions not only enhance the performance of electronic devices but also underscore the importance of collaborative efforts in research and development within the field.