Company Filing History:
Years Active: 2000
Title: The Innovative Contributions of Detelf Houdeau
Introduction
Detelf Houdeau is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of chip technology, particularly in the area of heat insulation for chip modules. His innovative approach has led to advancements that enhance the reliability and performance of chip cards.
Latest Patents
Detelf Houdeau holds a patent for a "Chip module with heat insulation for incorporation into a chip card." This invention specifically controls the heat flow introduced into a chip module from the outside to avoid delaminations between a covering composition and a chip during the hot-melt incorporation process. The technology involves either a heat-insulating layer interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or clearances within an area or layer of metal contacts. This design effectively prevents heat flow from a hollow punch brought down in an outer region of the metal contacts towards the centrally mounted chip.
Career Highlights
Detelf Houdeau is associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to focus on innovative solutions in chip technology, contributing to the company's reputation for excellence in engineering and technology.
Collaborations
Throughout his career, Detelf has collaborated with esteemed colleagues such as Josef Kirschbauer and Hans-Georg Mensch. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
Detelf Houdeau's contributions to chip technology exemplify the importance of innovation in the field. His patent on heat insulation for chip modules showcases his commitment to enhancing the functionality and reliability of chip cards. His work continues to influence the industry and inspire future advancements.