Siemens Aktiengesellschaft

Detelf Houdeau

Peter Stampka

Josef Kirschbauer

Hans-Georg Mensch

Hans-Hinnerk Steckhan

A heat flow which is introduced into a chip module from the outside is specifically controlled to avoid delaminations between a covering composition and a chip during a hot-melt incorporation process. This takes place either by a heat-insulating layer which is interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or by clearances within an area or layer of metal contacts. As a result, a heat flow from a hollow punch brought down in an outer region of the metal contacts, in the direction of the centrally mounted chip, is prevented.

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Wuppertal, Germany

Detelf Houdeau