Hong Kong, China

Desmond Wai Tse

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Desmond Wai Tse. Retrieved from https://idiyas.com/inventor/desmond-wai-tse

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

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Title: Desmond Wai Tse: Innovator in Object Location Technology

Introduction

Desmond Wai Tse is an inventive mind based in Hong Kong, CN. He has made significant contributions to the field of technology, particularly with his innovative device designed for locating objects behind wall linings.

Latest Patents

Desmond Wai Tse currently holds no patents. However, his notable invention is titled "Apparatus And Method For Locating Objects Behind A Wall Lining." This device features a housing that fits comfortably in the palm of a user's hand. The operating switches are strategically placed for easy access without altering the grip on the housing. The device includes a sensor with a first capacitor plate and a pair of second capacitor plates arranged vertically. These plates are calibrated by a Pulse Width Modulator and integrator, with the operating electronics integrated into an Application Specific Integrated Circuit.

Career Highlights

Desmond is associated with Solar Wide Industrial Limited, where he applies his expertise in developing innovative solutions. His work focuses on enhancing the functionality and usability of devices that assist users in locating hidden objects.

Collaborations

Desmond collaborates with talented individuals such as Hughes Sanoner and Ronald Tak Yim, contributing to a dynamic work environment that fosters innovation.

Conclusion

Desmond Wai Tse is a dedicated inventor whose work in object location technology showcases his commitment to innovation and problem-solving. His contributions, although not yet patented, reflect a promising future in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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