Derya Z Tansel

Title: Derya Z Tansel: Innovator in Stretchable 3D-Printed Circuit Boards

Introduction

Derya Z Tansel is a prominent inventor based in Pittsburgh, PA (US). She has made significant contributions to the field of electronics through her innovative work on stretchable 3D-printed circuit boards. Her research focuses on enhancing the flexibility and functionality of electronic devices.

Latest Patents

Derya Z Tansel holds a patent for her invention titled "Stretchable 3D-printed circuit boards." This patent discloses devices that comprise stretchable 3D circuits and methods for fabricating these circuits. The fabrication process involves using an elastomeric polymer as a substrate and incorporating conductive interconnects within the substrate, which are encased in an insulating polymer, such as polyimide. This design provides a stiffness gradient between the conductive interconnects and the flexible elastomeric substrate. The circuit can be fabricated as a multilayer construction, utilizing three-dimensional pillars as vias and external interconnects.

Career Highlights

Derya Z Tansel is affiliated with Carnegie Mellon University, where she continues to advance her research in the field of electronics. Her work has garnered attention for its potential applications in various industries, including wearable technology and flexible electronics.

Collaborations

Derya has collaborated with notable colleagues, including Gary Keith Fedder and Rahul Panat. These collaborations have further enriched her research and contributed to the development of innovative technologies.

Conclusion

Derya Z Tansel is a trailblazer in the realm of stretchable electronics, with her patent on 3D-printed circuit boards showcasing her innovative spirit. Her contributions to the field are paving the way for future advancements in flexible electronic devices.