Bedford, PA, United States of America

Derrick T Hyde

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent. Top assignee: Icp Adhesives and Sealants, Inc.. Active years: 2017.


% Patents Active = 100.0


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Derrick T Hyde: Innovator in Foam Insulation Technology

Introduction

Derrick T Hyde is a notable inventor based in Bedford, PA (US). He has made significant contributions to the field of insulation technology, particularly through his innovative methods and compositions.

Latest Patents

Derrick holds a patent for a "Method and composition for filling elongated channels with expanding foam insulation." This invention focuses on utilizing low boiling point, low vapor pressure blowing agents with froth polyurethane or polyisocyanurate foams. It is designed to fill hollow cavities, such as window lineals, while minimizing deformation and enhancing the filling of longer lengths by increasing foaming and gel times.

Career Highlights

Derrick is currently employed at Icp Adhesives and Sealants, Inc., where he continues to develop and refine his innovative ideas. His work has been instrumental in advancing insulation technologies that improve energy efficiency and structural integrity.

Collaborations

Derrick collaborates with talented coworkers, including Anthony James Taylor and Timothy R Kenworthy. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Derrick T Hyde's contributions to foam insulation technology exemplify the impact of innovative thinking in practical applications. His work not only enhances product performance but also contributes to energy efficiency in construction.

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