Warsaw, IN, United States of America

Derek Hengda Liu

This inventor holds 1 USPTO granted patent. Top assignee: Depuy Synthes Products, Inc.. Active years: 2014.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Innovations by Derek Hengda Liu in Orthopedic Implants

Introduction

Derek Hengda Liu is an accomplished inventor based in Warsaw, IN (US). He has made significant contributions to the field of orthopedic implants, particularly through his innovative patent that focuses on enhancing the stability and biological fixation of implants.

Latest Patents

Derek holds a patent for "Implants with roughened surfaces." This invention provides methods for processing a green body that includes compacted metal powder. The process involves impacting the green body with a particulate material to displace a portion of the metal powder, resulting in a roughened surface. These methods are designed to create orthopedic implants that exhibit low movement relative to bone when installed, thereby increasing stability and reducing the time required for biological fixation.

Career Highlights

Derek is currently associated with DePuy Synthes Products, Inc., where he applies his expertise in developing advanced orthopedic solutions. His work has been instrumental in improving the design and functionality of implants, contributing to better patient outcomes.

Collaborations

Derek collaborates with notable colleagues, including Bryan J. Smith and Andrew J. Martin, who share his commitment to innovation in the medical field.

Conclusion

Derek Hengda Liu's contributions to orthopedic implants through his innovative patent demonstrate his dedication to advancing medical technology. His work not only enhances the stability of implants but also significantly improves the biological fixation process, ultimately benefiting patients in need of orthopedic solutions.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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