Shanghai, China

Denny Liu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Honeywell International Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Denny Liu. Retrieved from https://idiyas.com/inventor/denny-liu-6smf5eac

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Denny Liu: Innovator in Cable Technology

Introduction

Denny Liu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of cable technology, particularly with his innovative patent for a cable shell. His work is recognized for its potential to enhance the durability and functionality of cable systems.

Latest Patents

Denny Liu holds 1 patent for his invention of a cable shell. This patent showcases his ability to address practical challenges in cable design and manufacturing, reflecting his commitment to innovation in this area.

Career Highlights

Denny Liu is currently employed at Honeywell International Inc., a leading company known for its technological advancements and commitment to innovation. His role at Honeywell allows him to further develop his ideas and contribute to cutting-edge projects in the industry.

Collaborations

Throughout his career, Denny has collaborated with talented individuals such as Ken Jiang and Chris Jiang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions.

Conclusion

Denny Liu is a noteworthy inventor whose contributions to cable technology are shaping the future of the industry. His patent for a cable shell exemplifies his innovative spirit and dedication to improving technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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