's-Gravenhage, Netherlands

Dennis Van Den Berg



Average Co-Inventor Count = 5.8

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Delft, NL (2017)
  • 's-Gravenhage, NL (2021)

Company Filing History:


Years Active: 2017-2021

Loading Chart...
Loading Chart...
2 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Dennis van den Berg - Pioneering Atomic Layer Deposition

Introduction:

Dennis van den Berg, a talented inventor hailing from 's-Gravenhage, Netherlands, has revolutionized the field of semiconductor manufacturing with his groundbreaking patent titled "Method and apparatus for depositing atomic layers on a substrate." His innovative approach to atomic layer deposition has significantly advanced the precision and efficiency of thin film fabrication techniques.

Latest Patents:

Dennis van den Berg holds a remarkable 1 patent in his name, which details a method of performing atomic layer deposition. This patent showcases his expertise in developing cutting-edge technologies that drive progress in the semiconductor industry.

Career Highlights:

Dennis van den Berg is a key member of the research and development team at Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO, where he applies his unique insights to push the boundaries of thin film technologies. His contributions have been instrumental in shaping the future of semiconductor manufacturing processes.

Collaborations:

Throughout his career, Dennis has collaborated closely with esteemed colleagues such as Raymond Jacobus Wilhelmus Knaapen and Ruud Olieslagers. Together, they have worked synergistically to explore new avenues in atomic layer deposition and enhance the performance of semiconductor devices.

Conclusion:

In conclusion, Dennis van den Berg stands out as a visionary inventor in the realm of atomic layer deposition, with a track record of innovation that continues to impact the semiconductor industry. His dedication to pushing the boundaries of technology underscores his commitment to driving progress and shaping the future of thin film fabrication.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…