Epping, NH, United States of America

Dennis J Fitzmeyer



Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 107(Granted Patents)


Location History:

  • Epping, NH (US) (1991 - 1994)
  • Hampton, NH (US) (1994)

Company Filing History:


Years Active: 1991-1994

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Dennis J Fitzmeyer

Introduction

Dennis J Fitzmeyer is a notable inventor based in Epping, NH (US). He has made significant contributions to the field of adhesives, holding a total of three patents. His work focuses on developing innovative adhesive compositions that cater to various applications.

Latest Patents

One of Fitzmeyer's latest patents is for a cool melt glue, which is a hot-melt adhesive formulated for both glue-pot and glue-gun applications. This adhesive can be applied at temperatures no higher than 280°F, preferably at 250°F or lower. The composition boasts a heat resistance of at least 125°F and can be shaped into glue sticks for use in glue guns. The adhesive is compounded with tackifying resin and/or wax, resulting in a sharp viscosity profile achieved through the use of a high melt index adhesive polymer. Another notable patent is an adhesive composition that includes decorative polyester glitter flakes. This hot melt adhesive is designed to be used at low temperatures to prevent degradation of the glitter.

Career Highlights

Fitzmeyer has worked with Adhesive Technologies, Inc., where he has contributed to the development of innovative adhesive solutions. His expertise in formulating adhesives has made a significant impact in the industry.

Collaborations

Throughout his career, Fitzmeyer has collaborated with notable individuals such as Peter S Melendy and Robert L Ornsteen. These collaborations have further enhanced his work in adhesive technology.

Conclusion

Dennis J Fitzmeyer's contributions to adhesive technology through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the development of effective adhesive solutions.

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