Fairport, NY, United States of America

Dennis J Eichorst


Average Co-Inventor Count = 2.9

ph-index = 10

Forward Citations = 250(Granted Patents)


Location History:

  • Fairport, NY (US) (1998 - 2001)
  • Lenexa, KS (US) (2001 - 2002)

Company Filing History:


Years Active: 1998-2002

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27 patents (USPTO):Explore Patents

Title: Dennis J Eichorst: A Pioneer in Inventions

Introduction:

Dennis J Eichorst, based in Fairport, NY, is a true pioneer in the world of inventions. With a passion for innovation and a dedication to pushing the boundaries of what is possible, he has made significant contributions to various fields through his inventive spirit.

Latest Patents:

Among his impressive portfolio of 27 patents, Dennis J Eichorst's latest inventions include a "Film support with annealable layer and improved adhesion" and a "Film support with improved adhesion upon annealing". These patents showcase his expertise in developing advanced photographic elements with unique features and enhanced functionalities.

Career Highlights:

Dennis J Eichorst is known for his valuable contributions to the Eastman Kodak Company, where he has been instrumental in driving innovation and creativity. His innovative mindset and technical prowess have played a crucial role in shaping the company's success in the realm of inventions.

Collaborations:

Throughout his career, Dennis J Eichorst has collaborated closely with esteemed colleagues such as Debasis Majumdar and Paul Albert Christian. Together, they have synergized their skills and expertise to tackle complex challenges, leading to groundbreaking inventions and patents that have garnered acclaim in the industry.

Conclusion:

In conclusion, Dennis J Eichorst's relentless pursuit of innovation, coupled with his remarkable creativity and technical acumen, has rightfully established him as a pioneer in the world of inventions. His passion for pushing boundaries and his unwavering dedication to excellence continue to inspire and shape the landscape of invention for years to come.

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