Company Filing History:
Years Active: 2021-2024
Title: Dennis Fernandez Tresnado: Innovator in Semiconductor Packaging
Introduction
Dennis Fernandez Tresnado is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology. His work focuses on enhancing the reliability and efficiency of semiconductor packages.
Latest Patents
Dennis's latest patents include advancements in reliable semiconductor packages. One patent discloses semiconductor packages and methods for forming them. The semiconductor package features a package substrate with a die attached in a die attach region. A protective cover is placed over a sensor region of the die, secured by a cover adhesive that also acts as a standoff structure. This design creates multiple cavities beneath the protective cover, effectively reducing thermal stress. Another patent outlines a method for forming a semiconductor package, detailing the attachment of a die to a package substrate and the application of a cover adhesive. The protective cover is designed to enhance adhesion and protect the die active region, ensuring the integrity of the semiconductor package.
Career Highlights
Dennis is currently employed at Utac Headquarters Pte. Ltd., where he continues to innovate in the semiconductor industry. His expertise in semiconductor packaging has positioned him as a key player in his field.
Collaborations
Dennis collaborates with talented coworkers, including Wedanni Linsangan Micla and Hua Hong Tan. Their combined efforts contribute to the advancement of semiconductor technologies.
Conclusion
Dennis Fernandez Tresnado is a prominent inventor whose work in semiconductor packaging has led to significant advancements in the industry. His innovative patents reflect his commitment to improving technology and enhancing product reliability.