Hong Kong, China

Dennis Chit Yiu Chan

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015-2018

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3 patents (USPTO):Explore Patents

Title: Dennis Chit Yiu Chan: Innovator in Plating Catalyst Technology

Introduction

Dennis Chit Yiu Chan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of plating catalysts, holding a total of 3 patents. His innovative work focuses on developing solutions that enhance the process of electroless plating on non-conductive surfaces.

Latest Patents

Among his latest patents, one includes a plating catalyst and method that features a solution comprising a precious metal nanoparticle and a polymer. This polymer is polymerized from at least two monomers, one of which contains two or more carboxyl groups or carboxylic acid salt groups, while the other has π electron-available features. This solution is particularly useful as a catalyst for the electroless plating of metal on non-conductive surfaces. Another patent also revolves around a similar concept, utilizing a precious metal nanoparticle and a polymer derived from a monomer with carboxyl groups, aimed at improving the electroless plating process.

Career Highlights

Dennis Chan is currently associated with Rohm & Haas Electronic Materials LLC, where he applies his expertise in materials science and innovation. His work has been instrumental in advancing the technology related to plating catalysts, making significant strides in the industry.

Collaborations

Throughout his career, Dennis has collaborated with talented individuals such as Wenjia Zhou and Suk Kwan Kwong. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Dennis Chit Yiu Chan is a prominent figure in the field of plating catalyst technology, with a focus on enhancing electroless plating processes. His contributions through patents and collaborations continue to influence advancements in this area.

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