Denise M Ommen

Title: Innovator Spotlight: Denise M Ommen

Introduction

Denise M Ommen is a prominent inventor based in Tempe, AZ (US). She has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. Her work focuses on enhancing the performance and reliability of electronic components.

Latest Patents

One of her latest patents is for a low-profile ball-grid array semiconductor package. This innovative design includes a substrate attached to a support substrate, featuring an opening that allows for the integration of an integrated circuit chip. The bond pads on the chip are electrically connected to ball pads on the substrate's lower surface, with conductive solder balls attached to these pads. This design not only provides a low profile but also functions as a standoff, limiting the collapse of the solder balls when the package is attached to an application board.

Career Highlights

Denise has had a successful career at Motorola Corporation, where she has been instrumental in developing advanced semiconductor technologies. Her expertise in this area has led to numerous innovations that have improved the efficiency and effectiveness of electronic devices.

Collaborations

Throughout her career, Denise has collaborated with talented individuals such as John Baird and Tim Jones. These partnerships have fostered a creative environment that has resulted in groundbreaking advancements in semiconductor packaging.

Conclusion

Denise M Ommen's contributions to the field of semiconductor technology are noteworthy. Her innovative designs and collaborative efforts continue to influence the industry positively.