Ringwood, NJ, United States of America

Denis G Pearce

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Denis G Pearce. Retrieved from https://idiyas.com/inventor/denis-g-pearce

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:

goldMedal1 out of 834,453 
Other
 patents

Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovations by Denis G Pearce

Introduction

Denis G Pearce is an accomplished inventor based in Ringwood, NJ (US). He has made significant contributions to the field of cutting and machining hard materials. His innovative approach has led to the development of a unique method that enhances the efficiency of cutting tools.

Latest Patents

Denis holds a patent for a "Method for cutting and machining hard materials." This invention involves cutting tools and machining tools equipped with PCBN tips and/or coatings that are bonded to their cutting or machining surfaces. These tools are specifically designed for cutting or machining cement and mineral-based hard building materials, such as Hardiplank®.

Career Highlights

Throughout his career, Denis has focused on advancing technologies related to hard materials. His dedication to innovation has resulted in the successful patenting of his methods, showcasing his expertise in the field.

Collaborations

Denis has worked alongside Michael Julio Garcia, contributing to the development of cutting-edge technologies in their field. Their collaboration has fostered a creative environment that encourages innovation.

Conclusion

Denis G Pearce's contributions to the field of cutting and machining hard materials demonstrate his commitment to innovation and excellence. His patented methods are a testament to his expertise and dedication to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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