Jiangsu, China

Dengfeng Sun

This inventor holds 1 USPTO granted patent. Top assignee: Southeast University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dengfeng Sun. Retrieved from https://idiyas.com/inventor/dengfeng-sun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dengfeng Sun and Wearable Haptic Feedback for Human-Robot Interaction

Introduction

Dengfeng Sun is an inventor based in Jiangsu, China. His work includes a patent for a wearable haptic feedback device designed to support human-robot formation control.

Latest Patents

Sun’s listed patent, “Wearable Haptic Feedback Device for Human-Robot Formation Control,” describes a device with an interactive interface module and a main control module. The interface includes an input module and wearable haptic feedback components that provide extrusion-force, shear-force, and vibration feedback. The device can be wirelessly worn on a user’s arm and can communicate formation changes, motion guidance, and obstacle detection through these three types of haptic signals. The patent describes haptic feedback as a way to help users understand the capabilities and task conditions of external limbs, potentially making human-robot interaction easier and more immersive. Sun is listed with 1 patent.

Career Highlights

Sun is associated with Southeast University. His listed invention focuses on wearable interfaces for conveying information between people and robotic systems.

Collaborations

Hong Zeng and Jingtian Zhang are identified as Sun’s coworkers. The available information does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Dengfeng Sun’s listed patent presents a wearable approach to human-robot interaction, using distinct haptic signals to convey guidance, formation changes, and obstacle information.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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