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Years Active: 2018-2024
Title: Dejiang Chang: Innovator in Semiconductor Technology
Introduction
Dejiang Chang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative work has paved the way for advancements in multi-die packaging solutions.
Latest Patents
One of Dejiang Chang's latest patents is a package with different types of semiconductor dies attached to a flange. This multi-die package features a thermally conductive flange, a first semiconductor die made of a first semiconductor material, and a second semiconductor die made of a different semiconductor material. The first die is attached to the flange via a first die attach material, while the second die is attached using a second die attach material. Leads are configured to provide external electrical access to both semiconductor dies, enhancing the functionality and efficiency of the package. Additional embodiments of this multi-die package are also described in his patent.
Career Highlights
Throughout his career, Dejiang Chang has worked with notable companies in the semiconductor industry. He has been associated with Infineon Technologies AG and Macom Technology Solutions Holdings, Inc. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.
Collaborations
Dejiang Chang has collaborated with several professionals in his field, including Xikun Zhang and Bill Agar. These collaborations have further enriched his work and have led to the development of advanced semiconductor solutions.
Conclusion
Dejiang Chang is a distinguished inventor whose work in semiconductor technology continues to influence the industry. His patents and collaborations reflect his commitment to innovation and excellence in this vital field.