This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Title: Deepak Nayak - Innovator in Integrated Circuit Technology
Introduction
Deepak Nayak is a notable inventor in the field of integrated circuit technology. He has made significant contributions to the development of high-performance chip packages. His innovative designs focus on enhancing heat dissipation and improving the overall efficiency of integrated circuits.
Latest Patents
Deepak Nayak holds a patent titled "High Performance Integrated Circuit Chip Package And Method Of Making Same." This invention features a support substrate with conductors extending from one face to the opposite face. It also includes a multilayer wiring substrate for connecting chips mounted on it. The design incorporates a heat sink with microchannels, which are thermally conductive cushions that connect the heat sink to the chips. This configuration allows for a high-density chip package with excellent heat dissipation. The multilayer wiring substrate is formed using a self-aligned thin film wiring method, ensuring efficient internal wiring planes. The materials used for the support substrate and heat sink are chosen for their thermal expansion properties, matching that of silicon. The cushions are made of low melting point solder, preferably pure indium, which effectively absorbs thermal stresses while conducting heat efficiently.
Career Highlights
Throughout his career, Deepak Nayak has worked with various companies, including Iwona Turlik and Arnold Reisman. His experience in these organizations has contributed to his expertise in integrated circuit technology.
Collaborations
Deepak has collaborated with notable professionals in his field, including Iwona Turlik and Arnold Reisman. Their joint efforts have further advanced the development of innovative technologies in integrated circuits.
Conclusion
Deepak Nayak is a distinguished inventor whose work in integrated circuit technology has paved the way for advancements in chip packaging. His innovative designs and collaborations have significantly impacted the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile