Deborah Lynn Dittrich

Title: Innovations by Deborah Lynn Dittrich

Introduction

Deborah Lynn Dittrich is a notable inventor based in Apalachin, NY (US). She has made significant contributions to the field of electronic packaging, holding a total of 2 patents. Her work focuses on enhancing the reliability and performance of electronic components through innovative materials and processes.

Latest Patents

Deborah's latest patents include a "Lead protective coating composition, process and structure thereof." This invention pertains to an electronic package assembly where a low profile integrated circuit chip package is soldered to an organic substrate, such as a printed circuit board. The invention involves the use of ultraviolet photocured encapsulant material to reinforce the solder-lead connections, ensuring durability and reliability. Another significant patent is "Encapsulating a solder joint with a photo cured epoxy resin or cyanate." This patent also addresses the electronic package assembly, utilizing a similar approach with encapsulant materials to enhance the solder-lead connections.

Career Highlights

Deborah Lynn Dittrich is currently employed at International Business Machines Corporation (IBM). Her role at IBM allows her to work on cutting-edge technologies and contribute to advancements in electronic packaging. Her expertise in this area has positioned her as a valuable asset to her team and the company.

Collaborations

Deborah has collaborated with notable colleagues, including Konstantinos I Papathomas and Stephen Joseph Fuerniss. These collaborations have fostered innovation and have led to the development of impactful technologies in the field.

Conclusion

Deborah Lynn Dittrich's contributions to electronic packaging through her patents and work at IBM highlight her role as a leading inventor in her field. Her innovative approaches continue to influence the industry and enhance the reliability of electronic components.