Seattle, WA, United States of America

Deborah Jessica Mayfield

This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Deborah Jessica Mayfield. Retrieved from https://idiyas.com/inventor/deborah-jessica-mayfield

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations by Deborah Jessica Mayfield

Introduction

Deborah Jessica Mayfield is an accomplished inventor based in Seattle, WA. She has made significant contributions to the field of packaging technology. Her innovative approach focuses on enhancing the protection of items during transport.

Latest Patents

Deborah holds a patent for an "Impact Dampening Package." This invention features an impact absorber and an outer package designed to minimize damage during shipping. The impact absorber can be positioned to create a volume of air between the item and the bottom of the outer package. This design effectively reduces the impact force applied to the package, ensuring that the item remains secure and undamaged.

Career Highlights

Deborah is currently employed at Amazon Technologies, Inc., where she continues to develop innovative solutions for packaging challenges. Her work has been instrumental in improving the safety and reliability of product delivery.

Collaborations

Deborah collaborates with her coworker, Vasitha Obeyesekere, who also contributes to advancements in packaging technology.

Conclusion

Deborah Jessica Mayfield's contributions to the field of packaging through her innovative patent demonstrate her commitment to enhancing product safety during transport. Her work at Amazon Technologies, Inc. continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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