Deborah J Smith

Title: Deborah J Smith - Innovator in Microelectronic Circuit Substrate Structures

Introduction

Deborah J Smith is a notable inventor based in Fountain Valley, CA (US). She has made significant contributions to the field of microelectronics, particularly in the development of high-density multi-chip substrate structures. Her innovative work has led to the creation of a patented technology that enhances the performance and efficiency of electronic devices.

Latest Patents

Deborah holds a patent for a microelectronic circuit substrate structure that includes photoimageable materials. This high-density multi-chip (HDMI) substrate structure features alternating conductor metallization and insulating dielectric layers. The dielectric layers are formed through curtain coating of ultraviolet photoimageable epoxy material, while the metallization is created using electroless plating or sputtering of copper. The process involves photoimaging and developing the dielectric layers to form via holes, with vias being created through electroless copper plating.

Career Highlights

Throughout her career, Deborah has worked at Hughes Aircraft Company, where she has been instrumental in advancing microelectronic technologies. Her expertise in substrate structures has positioned her as a key player in the industry, contributing to the development of innovative solutions that meet the demands of modern electronics.

Collaborations

Deborah has collaborated with her coworker, James J Licari, to further enhance the research and development of microelectronic technologies. Their combined efforts have led to advancements in substrate design and manufacturing processes.

Conclusion

Deborah J Smith's contributions to microelectronic circuit substrate structures exemplify her innovative spirit and dedication to advancing technology. Her patented work continues to influence the field, showcasing the importance of innovation in electronics.