Debjit Datta

Title: Debjit Datta: Innovator in Semiconductor Technology

Introduction

Debjit Datta is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of modular construction of hybrid-bonded semiconductor die assemblies. His innovative work has led to advancements that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Debjit Datta holds a patent for "Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods." This patent describes stacked semiconductor assemblies that include a lowermost die and two or more modules carried by the upper surface of the lowermost die. Each module consists of a base die and one or more upper dies, all coupled via hybrid bonds. The modular construction allows for varying longitudinal footprints, optimizing the design and performance of semiconductor assemblies. He has 1 patent to his name.

Career Highlights

Debjit Datta is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has positioned him as a key player in the development of advanced semiconductor technologies. His expertise and innovative approach have contributed to the company's success in delivering cutting-edge solutions.

Collaborations

Throughout his career, Debjit has collaborated with notable colleagues, including Bharat Bhushan and Akshay N Singh. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Debjit Datta's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence the advancement of semiconductor assemblies, paving the way for future innovations.