Colchester, VT, United States of America

Dean W Siegel


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Dean W. Siegel - Innovator in Thin Film Technology

Introduction

Dean W. Siegel is a notable inventor based in Colchester, Vermont, known for his contributions to the field of thin film technology. With a focus on enhancing materials through innovative methods, Siegel has made significant strides in the application of impurities in thin films, leading to advancements in various technological applications.

Latest Patents

Dean W. Siegel holds a patent related to the "Incorporation of an impurity into a thin film." This invention describes a method for forming a thin film on a substrate within a deposition system. The process involves introducing a predetermined amount of an impurity in a confined volume within the system. Furthermore, one or more gases are utilized to facilitate the formation of the thin film, while the impurity is removed in a gas phase during this process, ultimately being incorporated into the film itself.

Career Highlights

Currently, Dean W. Siegel is associated with the International Business Machines Corporation (IBM), where he has made valuable contributions to research and development. His work at IBM is instrumental in pushing the boundaries of thin film technologies and their applications across various sectors, including electronics and materials science.

Collaborations

During his career, Dean has collaborated with talented professionals such as Charles Augustus Choate, IV, and Timothy S. Hayes. These collaborations have facilitated the exchange of knowledge and expertise, enhancing project outcomes and driving innovation within their respective fields.

Conclusion

Dean W. Siegel's work in the field of thin film technology exemplifies the spirit of innovation and collaboration that drives advancements in science and engineering. His patent and ongoing contributions at IBM highlight the importance of integrating impurities into thin films, paving the way for improved material properties and functionalities. The impact of his endeavors continues to resonate within the tech industry, inspiring future innovations.

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