Garland, TX, United States of America

Dean L Frew


Average Co-Inventor Count = 5.8

ph-index = 3

Forward Citations = 248(Granted Patents)


Location History:

  • Garland, TX (US) (1992 - 1994)
  • Springfield, VA (US) (1997)

Company Filing History:


Years Active: 1992-1997

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3 patents (USPTO):Explore Patents

Title: Innovations of Dean L. Frew

Introduction

Dean L. Frew is a notable inventor based in Garland, Texas. He has made significant contributions to the field of microelectronics, holding three patents that showcase his innovative approaches to circuit design and assembly.

Latest Patents

One of his latest patents is titled "Solder bump transfer for microelectronics packaging and assembly." This invention outlines a method for creating microelectronic circuits, which includes a substrate, preferably silicon, with a nickel layer beneath a gold layer. The process involves forming regions on the substrate for connecting electrical components using a first metallurgy, typically gold, and creating a pattern of solder bumps from a second metallurgy, such as lead/tin solder. The solder bumps are applied to the substrate and heated to ensure proper flow and bonding.

Another significant patent is "Three dimensional assembly of integrated circuit chips." This invention describes a multi-chip circuit module consisting of a laminated stack of circuit chips. Each chip features multiple layers of thin film interconnect patterns, with the final layers designed to relocate input and output pads to a single edge. This innovative design allows for the formation of an array of leads on one lateral face of the laminated chip stack, enhancing connectivity and efficiency.

Career Highlights

Dean L. Frew is currently employed at Texas Instruments Corporation, where he continues to develop cutting-edge technologies in microelectronics. His work has had a profound impact on the industry, particularly in the areas of circuit design and assembly techniques.

Collaborations

Throughout his career, Dean has collaborated with notable colleagues, including Arthur M. Wilson and Mark A. Kressley. These partnerships have contributed to the advancement of innovative solutions in microelectronics.

Conclusion

Dean L. Frew's contributions to microelectronics through his patents and work at Texas Instruments Corporation highlight his role as a leading inventor in the field. His innovative methods and designs continue to influence the industry and pave the way for future advancements.

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