Chongqing, China

Dayu Shu

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignees: No.59 Research Institute of China Ordnance Industry, Harbin Institute of Technology at Weihai, Southwest Technology and Engineering Research Institute. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dayu Shu. Retrieved from https://idiyas.com/inventor/dayu-shu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 8.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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3 patents (USPTO):Explore Patents

Title: Inventor Dayu Shu - Revolutionizing Technology in Chongqing

Introduction: Dayu Shu is a visionary inventor based in Chongqing, China, known for his groundbreaking contributions to the field of technology.

Latest Patents: Dayu Shu holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Dayu Shu has worked tirelessly to develop cutting-edge solutions that have the potential to shape the future of various industries. His passion for innovation and problem-solving has led to the creation of several revolutionary technologies.

Collaborations: Dayu Shu has collaborated with leading research institutions, universities, and tech companies to further his research and bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Dayu Shu's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a standout figure in the world of inventors. His work continues to inspire and pave the way for future generations of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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