This inventor holds 1 USPTO granted patent and 20 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Dawoon Jung - Innovator in Semiconductor Packaging
Introduction
Dawoon Jung is a talented inventor based in Suwon-si, South Korea. She specializes in semiconductor packaging technologies, contributing innovative ideas to the field. Her work focuses on enhancing the efficiency and functionality of semiconductor devices.
Latest Patent Applications
Dawoon Jung has submitted several notable patent applications. One of her latest applications involves a semiconductor package that includes a lower semiconductor chip with a top and bottom surface. An upper semiconductor chip is positioned on the top surface of the lower chip, with a dielectric layer in between. The design features a connection structure that connects both semiconductor chips, ensuring effective communication and performance. Another application describes a semiconductor package that incorporates a chip stack with first and second semiconductor chips. This design includes an upper cover member and an intermediate insertion member, enhancing the overall structure and functionality of the semiconductor package.
Conclusion
Dawoon Jung is making significant strides in the semiconductor industry with her innovative patent applications. Her contributions are poised to impact the future of semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile