This inventor holds 1 USPTO granted patent. Top assignee: Cisco Technology, Inc.. Active years: 2013.
Company Filing History:
Years Active: 2013
Title: Davie Senk: Innovator in Surface Roughness Measurement
Introduction
Davie Senk is an accomplished inventor based in San Ramon, CA (US). He has made significant contributions to the field of printed circuit boards (PCBs) through his innovative patent. His work focuses on enhancing the quality and precision of metal foil surfaces within PCBs.
Latest Patents
Davie Senk holds a patent titled "Method and apparatus for determining surface roughness of metal foil within printed circuits." This patent describes a method that captures an image of a printed circuit board, which includes at least one inner layer with a metal foil portion. The process involves determining the surface roughness of the metal foil by analyzing the captured image. This innovation is crucial for improving the performance and reliability of electronic devices.
Career Highlights
Davie Senk is currently employed at Cisco Technology, Inc., where he applies his expertise in technology and innovation. His work at Cisco has allowed him to contribute to advancements in electronic design and manufacturing processes. With a focus on quality and precision, he has established himself as a valuable asset in the industry.
Collaborations
Davie has collaborated with notable colleagues, including Scott Hinaga and Soumya De. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
In summary, Davie Senk is a prominent inventor whose work in surface roughness measurement has the potential to significantly impact the electronics industry. His innovative approach and dedication to quality continue to drive advancements in printed circuit board technology.