This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Allegro Microsystems, LLC. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: David Youm - Innovator in Integrated Circuit Packaging
Introduction
David Youm is a notable inventor based in Malden, MA (US). He has made significant contributions to the field of integrated circuit packaging, particularly with his innovative designs that enhance the performance and reliability of current sensor integrated circuits.
Latest Patents
David Youm holds a patent for an integrated circuit packaging with an insulation structure designed to control gap height and die tilt. This invention addresses the challenges associated with maintaining magnetic field coupling between the semiconductor die and the primary conductor. The insulation structure is strategically placed between the die and the lead frame, ensuring that the die remains level and that magnetic coupling is preserved. Additionally, the design incorporates epoxy dots to further control gap height and eliminate any potential die tilt.
Career Highlights
David Youm is currently employed at Allegro Microsystems, LLC, where he continues to develop innovative solutions in the field of integrated circuits. His work has been instrumental in advancing the technology used in current sensors, making them more efficient and reliable.
Collaborations
David collaborates with Weidong Wang, a fellow innovator at Allegro Microsystems, LLC. Together, they contribute to the ongoing development of cutting-edge technologies in integrated circuit packaging.
Conclusion
David Youm's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in engineering. His patent reflects a deep understanding of the complexities involved in semiconductor technology, and his work continues to influence the industry positively.