Wysox, PA, United States of America

David W Rudman

This inventor holds 1 USPTO granted patent. Top assignee: Union Camp Corporation. Active years: 1976.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David W Rudman. Retrieved from https://idiyas.com/inventor/david-w-rudman-3pycni5k

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1976

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of David W. Rudman

Introduction

David W. Rudman is an accomplished inventor based in Wysox, Pennsylvania. He has made significant contributions to the field of packaging through his innovative methods. His work primarily focuses on improving the efficiency and functionality of packaging solutions.

Latest Patents

David W. Rudman holds a patent for a "Method for combining partition and box blank and for making a double." This patent describes a method of assembly that allows for the combination of a partition with a box blank. The result is a combination partition box that can be collapsed for shipping and use, as well as a double wall thickness box. This innovation enhances the durability and usability of packaging products.

Career Highlights

Rudman is associated with Union Camp Corporation, where he has applied his expertise in packaging design and manufacturing. His work has contributed to the development of more efficient packaging solutions that meet the needs of various industries.

Collaborations

Throughout his career, David has collaborated with notable colleagues, including Howard T. Hackman and Ray Brown. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

David W. Rudman's contributions to the field of packaging through his innovative methods and collaborations have made a lasting impact. His work continues to influence the industry and improve packaging solutions for various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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