David W Hula

Title: David W Hula: Innovator in Integrated Circuit Metallization

Introduction

David W Hula is a notable inventor based in Fort Collins, CO (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 5 patents. His work focuses on improving the performance and reliability of integrated circuits through innovative metallization techniques.

Latest Patents

One of Hula's latest patents is titled "Integrated circuit metallization using a titanium/aluminum alloy." This invention presents an integrated circuit metallization structure that utilizes a titanium/aluminum alloy. The method aims to reduce leakage current by allowing mobile impurities such as water, oxygen, and hydrogen to passivate structural defects in the silicon layer of the integrated circuit. The titanium layer is at least partially alloyed with the aluminum layer, which restricts the titanium's ability to getter mobile impurities within the various layers of the integrated circuit. Despite this alloying, the metallization structure maintains superior contact resistance and electromigration properties associated with titanium.

Career Highlights

David W Hula is currently employed at Agilent Technologies, Inc., where he continues to develop innovative solutions in integrated circuit technology. His expertise and contributions have positioned him as a key figure in his field.

Collaborations

Hula has collaborated with notable coworkers, including Robert G Long and Ricky D Snyder, who have also contributed to advancements in technology.

Conclusion

David W Hula's work in integrated circuit metallization showcases his innovative spirit and dedication to enhancing technology. His patents reflect a commitment to solving complex challenges in the field, making him a valuable contributor to the industry.