Warren, PA, United States of America

David T Swanson

This inventor holds 2 USPTO granted patents. Top assignee: Gte Products Corporation. Active years: 1990-1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David T Swanson. Retrieved from https://idiyas.com/inventor/david-t-swanson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 1990-1993

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2 patents (USPTO):Explore Patents

Title: David T. Swanson: Innovator in Printed Circuit Technology

Introduction

David T. Swanson is a notable inventor based in Warren, PA (US). He has made significant contributions to the field of printed circuit technology, holding 2 patents that showcase his innovative approaches.

Latest Patents

One of his latest patents is for a printed circuit assembly with contact dot. This invention describes a method of applying discrete areas of noble metal to individual pads on a flexible printed circuit board. The process involves forming a specific pattern of electrically conductive material on a flexible, electrically insulating substrate, which includes individual pads. An aperture is created through the substrate to expose a portion of the underside of at least one pad. The method continues with contacting the underside with an electrode and the upper surface of the pad with a wire made of noble metal. A welding current is then applied to weld the wire to the pad, followed by severing the wire to leave a specific amount on the pad's surface.

Another patent by Swanson also focuses on printed circuit assemblies with gold dot contacts formed on terminal pads. This method involves overlaying a first layer of copper with a pattern of tin or solder that acts as a resist. The gold dot contacts are resistance welded to the terminal pads. The copper underlayment, along with its pattern of tin or solder carrying the gold dots, is bonded to an electrically insulating substrate, which can be flexible. This composite board is then etched to create a printed circuit board featuring gold dot contacts.

Career Highlights

David T. Swanson is associated with GTE Products Corporation, where he has been able to apply his innovative ideas in practical applications. His work has significantly impacted the development of printed circuit technology.

Collaborations

Throughout his career, Swanson has collaborated with notable coworkers such as Frank J. Avellino and Richard A. Case. Their combined expertise has contributed to advancements in their field.

Conclusion

David T. Swanson's contributions to printed circuit technology through his patents reflect his innovative spirit and dedication to advancing the industry. His work continues to influence the development of modern electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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