David T Naugle

Title: Innovations by David T Naugle

Introduction

David T Naugle is a notable inventor based in Poughkeepsie, NY. He has made significant contributions to the field of technology, particularly in semiconductor manufacturing and microdispensing tools. With a total of two patents to his name, Naugle's work reflects a commitment to advancing engineering solutions.

Latest Patents

Naugle's latest patents include the "Injection Molded Solder Ball Method" and the "Contact Sensor-Based Microdispensing Tool." The Injection Molded Solder Ball Method discloses techniques for creating solder balls that can be utilized to bump semiconductor wafers. This method employs an injection molded soldering (IMS) process, enhancing the efficiency of semiconductor manufacturing. The Contact Sensor-Based Microdispensing Tool is designed for delivering minute globules of epoxy material to high circuit density modules. This innovative tool features a solid probe integrated with a contact sensor assembly, which utilizes an air-levitated core of a linear voltage differential transducer. The design allows for precise dispensing, ensuring that the globule flows accurately onto the repair site.

Career Highlights

David T Naugle is currently employed at International Business Machines Corporation (IBM), where he continues to develop cutting-edge technologies. His work at IBM has positioned him as a key player in the advancement of semiconductor and microdispensing technologies.

Collaborations

Throughout his career, Naugle has collaborated with talented individuals such as Annette B Antenucci and Michael Berger. These collaborations have contributed to the innovative projects he has undertaken.

Conclusion

David T Naugle's contributions to technology through his patents and work at IBM highlight his role as an influential inventor. His innovative approaches to solder ball manufacturing and microdispensing tools demonstrate his commitment to advancing engineering solutions.