International Business Machines Corporation

David T Naugle

Peter Alfred Gruber

Jae Man Park

Michael Berger

Stephen Arnold Olson

Benoit Ventimiglia

Annette B Antenucci

Barry A Hochlowski

Richard J Weckesser

Thomas Rednour

Judy E Lambert

Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.

Injection molded solder ball method

A contact-based microdispensing tool for delivering extremely minute globules of epoxy material to repaired sites on high circuit density modules. The tool includes a solid probe integrally mounted in a contact sensor assembly incorporating an air-levitated core of a linear voltage differential transducer. The levitated core and the probe connected thereto are supported in neutral equilibrium by an air bearing assembly. As the assembly probe is brought into contact with one of the sites, the globule flows upon the site, the equilibrium is disturbed and a signal is produced by the transducer to halt movement of the probe relative to the site.

Contact sensor-based microdispensing tool

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Poughkeepsie, NY, United States of America

David T Naugle