David Starling

Title: David Starling and Cryogenic Quantum-Emitter Packaging.

Introduction

David Starling is an inventor associated with the Massachusetts Institute of Technology in Cambridge, Massachusetts. His patent work addresses a packaging approach for quantum emitters intended for cryogenic applications and quantum-network systems.

Latest Patents

Starling is associated with 1 patent: “High Density Fiber Optic Packaging for Cryogenic Applications.” The invention describes a quantum-emitter module designed to function as a quantum memory within a scalable, network-compatible architecture. It uses a diamond microchiplet containing silicon-vacancy or other color-center quantum emitters, integrated with a silicon photonic integrated circuit.

The photonic circuit is secured to a silicon bench with cryo-compatible epoxy. Its waveguides are butt-coupled to optical fibers held in a silicon V-groove array, which is also attached to the bench. A fast-curing epoxy temporarily holds the array to the circuit while the cryo-compatible epoxy cures, supporting mechanical stability across room-temperature and cryogenic conditions.

Career Highlights

The patent focuses on a practical integration challenge in quantum technology: maintaining stable optical connections as a device moves between room temperature and cryogenic operating conditions. Its packaging design brings diamond-based quantum emitters, photonic circuitry, and fiber connections together in a module intended for quantum-memory applications.

Collaborations

The supplied information identifies William John Nowak and John D. Cummings as Starling’s coworkers. The patent description also reflects work at the intersection of quantum emitters, silicon photonics, and fiber-optic packaging.

Conclusion

David Starling’s patent presents a cryogenically stable packaging design that connects diamond quantum emitters with photonic circuitry and optical fibers for potential use in scalable quantum networks.