David S Perloff

Title: David S. Perloff: Innovator in Thin Film Characterization

Introduction

David S. Perloff is a notable inventor based in Los Altos Hills, California. He has made significant contributions to the field of thin film characterization through his innovative patent. His work focuses on enhancing the understanding of material properties at various depths within thin films.

Latest Patents

David S. Perloff holds a patent for a "System and method for depth profiling and characterization of thin films." This patent outlines a method for characterizing a sample by utilizing parameters in an electron spectroscopy method or system. The approach includes using low ion energy ions to remove material from the sample, thereby exposing progressively deeper layers. Additionally, it employs an ion beam at a low angle and an analyzer positioned at a high angle to receive photoelectrons. A correction algorithm is also integrated to determine the concentration of components versus depth within the sample.

Career Highlights

David is currently associated with Revera, Incorporated, where he applies his expertise in thin film characterization. His innovative methods have the potential to advance the field significantly, providing valuable insights into material properties.

Collaborations

David has collaborated with notable professionals in his field, including Paul E. Larson and John F. Moulder. These collaborations have likely contributed to the development and refinement of his innovative techniques.

Conclusion

David S. Perloff's contributions to thin film characterization through his patent demonstrate his commitment to advancing material science. His work continues to influence the understanding of thin films and their applications in various industries.