Delphi, IN, United States of America

David P Buehler

This inventor holds 1 USPTO granted patent. Top assignee: Delphi Technologies, Inc.. Active years: 2004.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: David P. Buehler: Innovator in Heat Sink Technology

Introduction

David P. Buehler is an accomplished inventor based in Delphi, IN (US). He has made significant contributions to the field of electronics through his innovative designs. His work primarily focuses on integrating electronics into heat sink technology, which enhances the efficiency and functionality of electronic devices.

Latest Patents

David P. Buehler holds a patent for a "Heat sink with integrated electronics." This invention features a heat sink that includes a cavity with one or more facing sides. Hybrid circuits are housed within these cavities, allowing for the integration of different types of circuits in a single, fully enclosed, yet partitioned housing. A bottom portion seals the housing and includes a row of pins for interconnecting the circuits housed in the separate cavities to an external device. This design significantly improves the versatility and performance of electronic systems.

Career Highlights

David is currently employed at Delphi Technologies, Inc., where he continues to innovate and develop advanced electronic solutions. His work has been instrumental in pushing the boundaries of heat sink technology and its applications in various electronic devices.

Collaborations

David has collaborated with his coworker, Daniel A. Lawlyes, to further enhance the development of their projects. Their teamwork has contributed to the successful implementation of innovative solutions in their field.

Conclusion

David P. Buehler is a notable inventor whose work in heat sink technology exemplifies innovation in electronics. His contributions continue to impact the industry positively.

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