Palatine, IL, United States of America

David O Williams

This inventor holds 1 USPTO granted patent. Top assignee: Commonwealth Edison Company. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David O Williams. Retrieved from https://idiyas.com/inventor/david-o-williams-f3ffjbdb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of David O. Williams

Introduction

David O. Williams is a notable inventor based in Palatine, Illinois. He has made significant contributions to the field of innovation, particularly with his unique invention related to plumbing. His work exemplifies the spirit of creativity and problem-solving that drives advancements in technology.

Latest Patents

David O. Williams holds a patent for a drain pipe insert. This invention addresses specific challenges in plumbing systems, showcasing his ability to identify and solve practical problems. With 1 patent to his name, Williams has demonstrated his innovative capabilities in a specialized area.

Career Highlights

Williams is currently employed at Commonwealth Edison Company, where he applies his expertise in engineering and innovation. His role at the company allows him to contribute to the development of efficient energy solutions, further enhancing his impact in the industry.

Collaborations

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Conclusion

David O. Williams is a remarkable inventor whose work in creating a drain pipe insert reflects his innovative spirit and dedication to improving plumbing systems. His contributions to Commonwealth Edison Company further highlight his commitment to advancing technology in practical applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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