Whitmore Lake, MI, United States of America

David Mulawka

This inventor holds 1 USPTO granted patent. Top assignee: Toyota Motor Engineering & Manufacturing North America, Inc.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David Mulawka. Retrieved from https://idiyas.com/inventor/david-mulawka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: David Mulawka: Vehicle Hinge-Cover Invention

Introduction

David Mulawka is an inventor associated with Whitmore Lake, Michigan, and Toyota Motor Engineering & Manufacturing North America, Inc. His patent work addresses a vehicle component designed to cover the hinge arm connecting a truck lid to the vehicle.

Latest Patents

Mulawka is credited with 1 patent, titled “Hinge arm fitting feature.” The invention describes a garnish that covers the hinge arm. Its inside surface includes a rib near one end, while a flange extends generally perpendicular to that end. Together, these features help secure the garnish and improve its coverage of nearby vehicle components.

Career Highlights

The patent reflects Mulawka’s contribution to automotive component design through a practical feature intended to improve the fit and coverage of a vehicle hinge-arm garnish. His listed company is Toyota Motor Engineering & Manufacturing North America, Inc.

Collaborations

Mulawka’s listed coworkers include Que-Whang Rhee and Junji Tanabe. The available information identifies them as coworkers but does not specify their roles in the patent.

Conclusion

David Mulawka’s “Hinge arm fitting feature” patent describes a rib-and-flange design intended to secure a garnish and cover vehicle hinge components more effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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