Company Filing History:
Years Active: 2008
Title: The Innovative Contributions of David M File
Introduction
David M File is a notable inventor based in Lyons, Indiana, recognized for his significant contributions to the field of materials science. He holds a patent that showcases his expertise in creating advanced wear-resistant materials. His work is particularly relevant in industries that require durable and electrically conductive components.
Latest Patents
David M File's most recent patent is titled "Wear-resistant electrically conductive body." This innovative method involves creating a wear-resistant electrically conductive body with an electrically conductive diamond-like carbon coating. The process includes ion-accelerating copper ions from a copper ion source onto a negatively charged electrically conductive body while simultaneously ion-accelerating diamond-like carbon ions from a separate carbon ion source. Additionally, he has developed a dual ion-beam process for depositing a wear-resistant diamond-like carbon coating on a negatively charged electrically conductive surface. This method utilizes an ion-beam to stabilize ionized carbon atoms that have been ion-accelerated onto the surface.
Career Highlights
David M File is associated with the United States Navy, where he contributes his expertise in materials engineering. His work has implications for various applications, particularly in enhancing the durability and performance of components used in demanding environments.
Collaborations
Throughout his career, David has collaborated with esteemed colleagues, including Kenneth Henry Heffner and Charles W Reed. These partnerships have fostered innovation and have been instrumental in advancing their shared goals in materials science.
Conclusion
David M File's innovative work in developing wear-resistant electrically conductive materials highlights his significant contributions to the field. His patented methods demonstrate a commitment to advancing technology and improving material performance in various applications.
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