This inventor holds 1 USPTO granted patent. Top assignee: Johnson Matthey Electronics, Inc.. Active years: 1997.
Company Filing History:
Years Active: 1997
Title: David M Damiano: Innovator in Electronic Packaging
Introduction
David M Damiano is a notable inventor based in Spokane, WA (US). He has made significant contributions to the field of electronic packaging through his innovative methods and designs. His work has been recognized in the industry, particularly for its practical applications in electronics.
Latest Patents
David holds a patent for an "Integral solder and plated sealing cover and method of making same." This patent describes a method of creating an integral solder and plated cover for electronic packages. The process involves applying a corrosion-resistant material onto a metal strip, followed by a solderable material on top of that. A solder material is then roll clad over the solderable material, which is subsequently stamped into covers that are coated with gold. This invention enhances the durability and reliability of electronic components.
Career Highlights
David is currently employed at Johnson Matthey Electronics, Inc., where he continues to innovate in the field of electronic packaging. His expertise and dedication to improving electronic components have made him a valuable asset to his company.
Collaborations
Throughout his career, David has worked alongside talented colleagues, including Mark Fery and Terry J Oldham. Their collaborative efforts have contributed to advancements in electronic packaging technologies.
Conclusion
David M Damiano's contributions to the field of electronic packaging through his innovative patent and work at Johnson Matthey Electronics, Inc. highlight his role as a significant inventor in the industry. His dedication to improving electronic components continues to impact the field positively.