David Lee Zamora

Title: **David Lee Zamora: Innovating Micro-Fluidic Device Packaging**

Introduction

David Lee Zamora, an accomplished inventor based in Albuquerque, NM, has made significant strides in the field of micro-fluidic device technology. With two patents to his name, Zamora's inventive contributions are enhancing the efficiency and effectiveness of fluidic devices in various applications.

Latest Patents

Zamora's latest patents focus on innovative packaging methods for surface micromachined electro-microfluidic devices. The first patent details a method of packaging and assembling these devices, presenting a new architecture that effectively transitions fluid from macro-scale (microliters) to device scale (picoliters). The design emulates electronics packaging technology and features a larger package consisting of a circuit board with embedded fluidic channels and standard fluidic connectors, like the Fluidic Printed Wiring Board. This setup connects to a smaller Electro-Microfluidic Dual-Inline-Package (EMDIP), which delivers fluid to the microfluidic integrated circuit (MIC). The connection strategy employs Bosch-etched holes that direct the fluid to the micromachined channels, while electrical connections are made to the bond pads on the front of the MIC.

Another of his patents emphasizes similar principles of packaging electro-microfluidic devices, reinforcing Zamora's commitment to advancing technology in this niche area.

Career Highlights

Zamora is currently employed at Sandia Corporation, where he applies his expertise in fluidics and micro-engineering to develop cutting-edge technologies. His innovative solutions have positioned him as a key contributor within the organization, influencing the future of micro-fluidic applications.

Collaborations

Throughout his career, Zamora has collaborated with notable colleagues such as Gilbert L. Benavides and Paul Charles Galambos. These collaborations have fostered a creative environment that enables the exchange of ideas and technologies, further driving advancement in the field.

Conclusion

David Lee Zamora's pioneering work in the packaging and assembly of micro-fluidic devices illustrates his dedication to innovation and excellence. His patents are not only a testament to his inventive capabilities but also a significant contribution to the ongoing evolution of fluidic technologies. Through his work at Sandia Corporation and collaborative efforts with esteemed colleagues, Zamora continues to shape the future of this compelling field.