Midland, MI, United States of America

David Lee Wyman



Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2009

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by David Lee Wyman: Pioneering Silsesquioxane Resin

Introduction

David Lee Wyman, an esteemed inventor based in Midland, MI, has earned a reputation for his significant contributions to materials science. With a focus on developing innovative chemical compounds, Wyman's work embodies the spirit of innovation and continues to impact various industries.

Latest Patents

Wyman holds a patent for a silsesquioxane resin that demonstrates remarkable lithographic properties. This resin shows improvements in etch-resistance, transparency, resolution, sensitivity, focus latitude, line edge roughness, and adhesion, making it suitable for use as a photoresist. His invention incorporates fluorinated or non-fluorinated functional groups into the silsesquioxane backbone, represented by the general structure (HSiO)(RSiO), where R is an acid dissociable group, and specific values for the parameters a and b ensure optimal performance.

Career Highlights

Wyman is currently affiliated with Dow Corning Corporation, a leader in silicon-based innovations. His work at this prominent organization showcases his dedication to advancing technology through innovative materials. His patent contributes to the evolving landscape of lithography and semiconductor processing.

Collaborations

Throughout his career, Wyman has collaborated with talented professionals such as Sanlin Hu and Eric S. Moyer. These partnerships have fostered a creative environment that boosts innovation and leads to groundbreaking developments in their respective fields.

Conclusion

David Lee Wyman's contributions to the field of silsesquioxane resins are a testament to his innovative spirit and commitment to excellence. As he continues to work at Dow Corning Corporation, his efforts pave the way for future advancements in material sciences and related applications.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…